Advanced Data Converters for
Next Generation Sensing and Communications

Leveraging Deep Sub-micron Process Nodes for Unprecedented Performance and Integration

Featured Product: Electra-MA

Jariet Products

Highly Integrated.

Mixed-Signal.

VHF to Ka-Band.

Packaged
RF/Microwave
Transceiver ICs

Commercially available or customized packaged IC products with integrated ADC/DACs, clocking, calibration, and DSP

Transceiver
Chiplets

Die-level transceiver products with AIB or SerDes interfaces for use in customer-developed Multi-chip Modules (MCMs) or System in Packages (SiPs)

Mixed-signal
Multi-chip Modules

Developed by Jariet in close cooperation with our customers, leveraging Jariet’s expertise in advanced, heterogeneous packaging techniques for high-frequency devices