Advanced Data Converters for
Next Generation Sensing and Communications
Leveraging Deep Sub-micron Process Nodes for Unprecedented Performance and Integration
Featured Product: Electra-MA
Jariet Products
Highly Integrated.
Mixed-Signal.
VHF to Ka-Band.
Packaged
RF/Microwave
Transceiver ICs
Commercially available or customized packaged IC products with integrated ADC/DACs, clocking, calibration, and DSP
Transceiver
Chiplets
Die-level transceiver products with AIB or SerDes interfaces for use in customer-developed Multi-chip Modules (MCMs) or System in Packages (SiPs)
Mixed-signal
Multi-chip Modules
Developed by Jariet in close cooperation with our customers, leveraging Jariet’s expertise in advanced, heterogeneous packaging techniques for high-frequency devices